Sputtering device
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United States of America Patent
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Issued Date -
Apr 12, 2007
app pub date -
Oct 4, 2006
filing date -
Oct 6, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A sputtering device according to the present invention comprises at least a vacuum container, a substrate holder arranged in the vacuum container, plural sputtering cathodes each of which has a target for sputtering to a substrate installed on the substrate holder, wherein the plural sputtering cathodes are arranged so that center axes of the targets installed on the sputtering cathodes is inclined at specific angle against an axis of the substrate installed on the substrate holder, and a sputtering cathode unit constituted of the plural sputtering cathodes is held to the vacuum container rotatably around the axis of said substrate.
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