Method for covering copper with patina
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United States of America Patent
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Issued Date -
Apr 12, 2007
app pub date -
Nov 17, 2004
filing date -
Nov 17, 2003
priority date (Note) -
Abandoned
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Abstract
A process for patinating articles comprising copper or a copper alloy is described. The articles to be patinated are treated with a preferably aqueous patination solution which preferably contains copper ions and zinc ions and are subsequently subjected to a maturing process. This is, in particular, carried out in a temperature- and humidity-controlled chamber.
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