Bonding system, and a bonding system method for the fabrication of lamps
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United States of America Patent
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Issued Date -
Apr 5, 2007
app pub date -
Sep 14, 2006
filing date -
Sep 30, 2005
priority date (Note) -
Abandoned
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Abstract
The invention relates to a bonding system method and for the fabrication of a bonding system, as well as to a light device formed using the method of the invention. The bonding of the two components which are to be joined, whereby at least one of the two components consists at least partially, preferably completely of glass or glass-ceramics, in other words of a glass-based material, is achieved by way of the following methods on their own merit. Through material sealing when utilizing an inorganic glass-based solder material or through sealing mechanisms without solder material by utilizing tensile stress and/or compressive strain conditions, at least in a high temperature range.
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