LIGHT EMITTING DIODE AND THE PACKAGE STRUCTURE THEREOF
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United States of America Patent
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Issued Date -
Apr 5, 2007
app pub date -
Jul 5, 2006
filing date -
Jul 7, 2005
priority date (Note) -
Abandoned
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Abstract
A light emitting diode (LED) is disclosed. The LED includes a substrate, a patterned semiconductor layer, two contact pads, a dielectric layer and a fluorescence thin film. Wherein, the patterned semiconductor layer is disposed on the substrate and suitable for emitting a first light, while the contact pads are disposed on the patterned semiconductor layer. The dielectric layer covers the patterned semiconductor layer and exposes a portion of the contact pads. In addition, the fluorescence thin film is disposed on the dielectric layer and emits a second light with a wavelength different from the first light after irradiated by the first light. Moreover, a LED package with the above-described LED is provided as well.
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