Flame-proofed polyamide molding materials and the use thereof
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United States of America Patent
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Issued Date -
Mar 29, 2007
app pub date -
Oct 6, 2004
filing date -
Oct 6, 2003
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Abandoned
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Abstract
The invention relates to halogen-free flameproof moulding compounds based on mixtures of aliphatic and partly aromatic polyamides, which contain salts of phosphinic acids as flameproofing agents. Furthermore, the invention relates to the use of the polyamide moulding compounds according to the invention for producing moulded articles, in particular into components for the electrical and electronics industry.
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