Polymer light emitting diode having interinsulation layer and method for fabricating the same
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United States of America Patent
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Issued Date -
Mar 29, 2007
app pub date -
Dec 29, 2005
filing date -
Sep 28, 2005
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Abandoned
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Abstract
A polymer light emitting diode having an interinsulation layer between a hole injecting layer (or a hole transporting layer) and a light emitting polymer layer, and a method for fabricating the polymer light emitting diode. The polymer light emitting diode having the interinsulation layer includes a hole injecting layer formed on an anode layer, formed on a glass substrate, by coating or printing; the interinsulation layer having a designated thickness formed on the hole injecting layer; a light emitting polymer layer formed on the interinsulation layer by coating or printing; and an electron injecting layer formed on the light emitting polymer layer, and a cathode layer formed on the electron injecting layer.
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