Soldering apparatus
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United States of America Patent
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Issued Date -
Mar 29, 2007
app pub date -
Sep 21, 2006
filing date -
Sep 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An R-ALIP type electromagnetic pump having an inner core, a linear pipe, and a combination of an outer core and coils provided around the linear pipe is disposed outside a solder vessel containing a molten solder. The solder vessel has a bottom wall made of an iron having at least 100 times as high a magnetic permeability as that of the molten solder and having a magnetic permeability not less than that of the inner core and a wall thickness not less than that of the inner core so that a magnetic field from the R-ALIP type electromagnetic pump cannot leak into the solder. Therefore, a stray current derived from an alternating magnetic field can be prevented from spreading in the molten solder.
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