Water-based polishing pads having improved adhesion properties and methods of manufacture
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United States of America Patent
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Issued Date -
Mar 22, 2007
app pub date -
Aug 14, 2006
filing date -
Sep 19, 2005
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Abstract
The present invention provides a chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, and wherein the polymeric matrix is applied on a permeable substrate. The present invention provides a water-based polishing pad with reduced defectivity and improved polishing performance.
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