Heat dissipating system
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United States of America Patent
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N/A
Issued Date -
Mar 22, 2007
app pub date -
Mar 28, 2006
filing date -
Sep 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipating system adapted for cooling an electronic device includes: a heat sink adapted to be connected to the electronic device; a driving mechanism; a cooling mechanism; a coolant circulating conduit adapted for receiving a coolant therein, and connected to the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit through the heat sink and the cooling mechanism; and a pressure sensing mechanism including a pressure sensing unit connected to the coolant circulating conduit for measuring the pressure inside the coolant circulating conduit, and an alarm coupled to the pressure sensing unit and activated by the pressure sensing unit when the pressure measured by the pressure sensing unit is below a predetermined value.
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