Heat dissipating system
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United States of America Patent
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N/A
Issued Date -
Mar 22, 2007
app pub date -
Mar 28, 2006
filing date -
Sep 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipating system for cooling an electronic device includes: a heat sink adapted to be connected to the electronic device for absorbing heat from the electronic device; a cooling fluid containing a coolant and a particulate material dispersed in the coolant; a driving mechanism; a cooling mechanism; and a coolant circulating conduit. The coolant circulating conduit receives the cooling fluid therein, and is connected to the heat sink and the driving mechanism. The driving mechanism drives circulation of the cooling fluid in the coolant circulating conduit through the heat sink. The coolant circulating conduit is further coupled to the cooling mechanism so as to transfer heat from the heat sink to the cooling mechanism through the cooling fluid.
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