Heat dissipating system
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United States of America Patent
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N/A
Issued Date -
Mar 22, 2007
app pub date -
Mar 28, 2006
filing date -
Sep 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipating system includes: a heat sink adapted to be connected to an electronic device; a coolant reservoir adapted for storing a coolant therein; a driving mechanism; a cooling mechanism; a coolant circulating conduit connected to the coolant reservoir, the cooling mechanism, the heat sink, and the driving mechanism such that the driving mechanism drives circulation of the coolant in the coolant circulating conduit; and a pressure stabilizing mechanism including a bypass connected to the coolant reservoir and the coolant circulating conduit at a position downstream of the driving mechanism, and a valve. The valve is opened when the pressure inside the coolant circulating conduit exceeds a predetermined value, thereby permitting fluid communication between the coolant reservoir and the coolant circulating conduit through the bypass.
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