Method of separating adhesive-bonded body

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070062643A1
SERIAL NO

10571552

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of separating an adhesive-bonded body is provided, by which a pair of pieces bonded together by using an adhesive can be easily securely separated from each other, wherein the adhesive has excellent adhesive force without being influenced by environmental temperature, excellent storage stability and wide scope of selection of the piece to be bonded. An adhesive-bonded body 1 includes a pair of pieces 2 bonded together and an adhesive layer 4. The adhesive layer 4 bonds the pair of pieces 2 to each other. Ultrasonic vibration is applied to the adhesive-bonded body 1 which is put between a tool horn 6 and an anvil 7 of an ultrasonic vibration applying device 3. The ultrasonic vibration is generated by applying a voltage to a piezoelectric vibrator 5 and vibrates the tool horn 6. The tool horn 6 vibrates ultrasonically together with one piece 2. The pair of the pieces 2 bonded together shifts relatively each other due to the ultrasonic vibration. The adhesive layer 4 is heated due to the ultrasonic vibration, so that the strength of the adhesive layer 4 is decreased. The pair of pieces 2 bonded together of the adhesive-bonded body 1, which includes the adhesive layer 4 having the decreased strength due to the ultrasonic vibration, is separated into the respective separated pieces.

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Patent Owner(s)

Patent OwnerAddress
YAZAKI CORPORATIONTOKYO JAPAN
SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA4-4 NISHITEMMA 2-CHOME KITA-KU OSAKA 530

International Classification(s)

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  • 2004 Application Filing Year
  • B29C Class
  • 1620 Applications Filed
  • 752 Patents Issued To-Date
  • 46.42 % Issued To-Date

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsuda, Masanori Shiga, JP 36 238
Suematsu, Mikotoshi Shiga, JP 1 4
Uematsu, Takashi Shizuoka, JP 26 359
Watanabe, Yoshihiko Shizuoka, JP 67 915
Yamaguchi, Shinishi Shiga, JP 1 4
Yamamura, Yuichiro Shiga, JP 3 30

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Patent Citation Ranking

  • 4 Citation Count
  • B29C Class
  • 4.57 % this patent is cited more than
  • 18 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges496302468031159432301 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 90100 +050100150200250300350400450500550600650700

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