Method of separating adhesive-bonded body
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 22, 2007
app pub date -
Sep 9, 2004
filing date -
Sep 12, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of separating an adhesive-bonded body is provided, by which a pair of pieces bonded together by using an adhesive can be easily securely separated from each other, wherein the adhesive has excellent adhesive force without being influenced by environmental temperature, excellent storage stability and wide scope of selection of the piece to be bonded. An adhesive-bonded body 1 includes a pair of pieces 2 bonded together and an adhesive layer 4. The adhesive layer 4 bonds the pair of pieces 2 to each other. Ultrasonic vibration is applied to the adhesive-bonded body 1 which is put between a tool horn 6 and an anvil 7 of an ultrasonic vibration applying device 3. The ultrasonic vibration is generated by applying a voltage to a piezoelectric vibrator 5 and vibrates the tool horn 6. The tool horn 6 vibrates ultrasonically together with one piece 2. The pair of the pieces 2 bonded together shifts relatively each other due to the ultrasonic vibration. The adhesive layer 4 is heated due to the ultrasonic vibration, so that the strength of the adhesive layer 4 is decreased. The pair of pieces 2 bonded together of the adhesive-bonded body 1, which includes the adhesive layer 4 having the decreased strength due to the ultrasonic vibration, is separated into the respective separated pieces.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
YAZAKI CORPORATION | TOKYO JAPAN | |
SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA | 4-4 NISHITEMMA 2-CHOME KITA-KU OSAKA 530 |
International Classification(s)

- 2004 Application Filing Year
- B29C Class
- 1620 Applications Filed
- 752 Patents Issued To-Date
- 46.42 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Matsuda, Masanori | Shiga, JP | 36 | 238 |
# of filed Patents : 36 Total Citations : 238 | |||
Suematsu, Mikotoshi | Shiga, JP | 1 | 4 |
# of filed Patents : 1 Total Citations : 4 | |||
Uematsu, Takashi | Shizuoka, JP | 26 | 359 |
# of filed Patents : 26 Total Citations : 359 | |||
Watanabe, Yoshihiko | Shizuoka, JP | 67 | 915 |
# of filed Patents : 67 Total Citations : 915 | |||
Yamaguchi, Shinishi | Shiga, JP | 1 | 4 |
# of filed Patents : 1 Total Citations : 4 | |||
Yamamura, Yuichiro | Shiga, JP | 3 | 30 |
# of filed Patents : 3 Total Citations : 30 |
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Patent Citation Ranking
- 4 Citation Count
- B29C Class
- 4.57 % this patent is cited more than
- 18 Age
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- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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