CUTTING SEGMENT, METHOD FOR MANUFACTURING CUTTING SEGMENT, AND CUTTING TOOL COMPRISING THE SAME
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United States of America Patent
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Issued Date -
Mar 15, 2007
app pub date -
Apr 13, 2006
filing date -
Apr 14, 2005
priority date (Note) -
Abandoned
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Abstract
A cutting segment for a cutting tool used for cutting or drilling brittle workpieces, such as stone, brick, concrete and asphalt, a method for manufacturing the segment, and a cutting tool comprising the segment are disclosed. The segment comprises layers of diamond particles and two kinds of plate-shaped metal matrix layers comprising soft and hard metal matrix layers having different ductility. The plate-shaped metal matrix layers are arranged perpendicular to a cutting surface while being parallel to a cutting direction, and are alternately stacked perpendicular to the cutting direction. The layers of diamond particles are suitably arranged in the plate-shaped soft and hard metal matrix layers. The segment and the cutting tool comprising the same have excellent cutting ability, and the manufacturing process thereof can be simplified, thereby remarkably enhancing productivity.
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