Label for in-mold molding and resin container decorated with the same

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United States of America Patent

APP PUB NO 20070054091A1
SERIAL NO

11217414

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Abstract

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A label for in-mold molding having a porosity of 10% or less and an opacity (in conformity with JIS-P-8138) of 20% or less, and comprising a thermoplastic resin film base layer (I) and a heat sealable resin layer (II), wherein the heat sealable resin layer (II) has the degree of a non-crystallinity of from 60 to 90% measured with a differential scanning calorimeter (DSC) at less than 90.degree. C., and contains a copolymer of propylene and .alpha.-olefin having from 4 to 20 carbon atoms, and a labeled container having the same.

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Patent Owner(s)

Patent OwnerAddress
YUPO CORPORATIONTOKYO 101-0062

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwasa, Yasuo Ibaraki, JP 27 213
Nishizawa, Takatoshi Ibaraki, JP 36 283
Shiina, Masaki Ibaraki, JP 27 196

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