Method and apparatus for end-point detection
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United States of America Patent
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app pub date -
Nov 10, 2006
filing date -
Jul 9, 1998
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Abandoned
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Abstract
An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.
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