Method of making sputtering target and target
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United States of America Patent
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Issued Date -
Mar 8, 2007
app pub date -
Aug 31, 2006
filing date -
Sep 7, 2005
priority date (Note) -
Abandoned
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Abstract
Method of making a sputtering target wherein the number of processing steps is reduced by providing melted sputtering target material in a heated mold and solidifying the melted material in the mold using a unidirectional heat removal process to produce a sputtering target with a selective grain orientation. The method can produce a solidified sputtering target having a selectively oriented multigrain microstructure or a selectively oriented single crystal microstructure suited or tailored to the sputtering process to be subsequently employed using the target.
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