Method of fabricating a thin film magnetic sensor on a wafer
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United States of America Patent
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Mar 3, 2009
Grant Date -
Mar 1, 2007
app pub date -
Aug 24, 2005
filing date -
Aug 24, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.
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