PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD

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Oct 26, 2006
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Sep 14, 2004

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Abstract

A substrate processing system includes a deposition chamber and a plurality of tubular electrodes positioned within the deposition chamber defining plasma regions adjacent thereto.

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Patent Owner	Address
FOREFRONT INNOVATIVE TECHNOLOGIES INC	140 TURNBULL COURT CAMBRIDGE ONTARIO N3H 4W3

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Keshner, Marvin S	Sonora, CA	27	551
McClelland, Paul H	Monmouth, OR	56	2400

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PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION APPARATUS AND METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11553334

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11553334

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First Claim

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