Gyro device implemented by back-end semiconductor manufacturing process
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United States of America Patent
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Issued Date -
Mar 1, 2007
app pub date -
Nov 30, 2005
filing date -
Aug 25, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a single-chip gyro device, which includes a substrate, a plurality of metal layers and a plurality of dielectric layers, and a plurality of metal side walls. Each of the dielectric layers is located between two adjacent layers selected from a layer group consisting of the metal layers and the substrate. The metal side walls are located on edges of the plurality of dielectric layers so as to prevent the dielectric layers from being undercut and form a mechanical structure together with the metal layers and the dielectric layers to connect the circuit formed on the substrate.
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