Tape substrate having reinforcement layer for tape packages
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United States of America Patent
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Issued Date -
Feb 22, 2007
app pub date -
Mar 10, 2006
filing date -
Aug 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The following invention is directed to a tape substrate having a reinforcement layer for tape packages and a method of fabricating the same. In an example embodiment, a tape substrate for tape packages may include a base film, a circuit pattern formed on the base film, and at least one reinforcement layer formed over a surface of the base film. The base film may have sprocket holes formed at regular intervals in the surface of the base film along at least one outer edge of the base film. The at least one reinforcement layer may have guide holes corresponding to the sprocket holes of the base film that are larger than the sprocket holes. The example embodiment may also include at least one reinforcement being set back from the outer edge of the base film.
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