Partially etched leadframe packages having different top and bottom topologies
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United States of America Patent
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N/A
Issued Date -
Feb 22, 2007
app pub date -
Jan 24, 2006
filing date -
Aug 16, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
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