Device for separative machining of components made from brittle material with stress-free component mounting
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United States of America Patent
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app pub date -
Oct 27, 2006
filing date -
Apr 27, 2004
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Abstract
Device for separative machining of a component made from brittle material by generation of a thermally induced stress fracture on the component in a separation zone includes a laser device for directing a laser beam onto the component for separative machining. The component partially transmits the laser beam, in use, at least twice and with partial absorption of the laser beam, and one of simultaneously and serially along the separation zone, and at one of the same point(s). Mounting device is provided including a bearing surface upon which the component made from brittle material for machining can be mounted, in use, to avoid externally induced mechanical stresses on the component. Bearing surface includes a material highly transmissive for the laser beam. The bearing surface may include a material that is reflective for the laser beam instead of or in addition to the material highly transmissive for the laser beam.
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