Thickening method of an electroforming shim
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United States of America Patent
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Issued Date -
Feb 22, 2007
app pub date -
Aug 18, 2005
filing date -
Aug 18, 2005
priority date (Note) -
Abandoned
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Abstract
A thickening method of an electroforming shim is provided to increase the thickness of a metal shim. In this embodiment, an active solder with a rare earth element is used to increase the moisture on the substrate surface for the solder during the combining process. Afterwards the oxides of the rare earth element are expelled by mechanical stirring to produce a clean contact surface. The melted fillers moisturize on the substrate surface to achieve the combination.
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