Multilayer microperforated implant
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United States of America Patent
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Issued Date -
Feb 15, 2007
app pub date -
Aug 12, 2005
filing date -
Aug 12, 2005
priority date (Note) -
Abandoned
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Abstract
A multilayer microperforated implant comprising a plurality of microperforated substrate layers is provided. Methods of forming a microperforated implant comprise providing at least one substrate layer; perforating at least a region of the substrate layer; and dehydrating the substrate layer. Methods of augmenting a site in need of repair with the microperforated implant are also provided.
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