Titanium-tungsten alloy based mirrors and electrodes in bulk acoustic wave devices
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United States of America Patent
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Issued Date -
Feb 15, 2007
app pub date -
Aug 11, 2005
filing date -
Aug 11, 2005
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Abandoned
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Abstract
Titanium-tungsten alloy based mirrors and electrodes in bulk acoustic wave devices simplify processing by eliminating the need for adhesion, barrier and seed layers, and preserve the advantages of tungsten layers. Alternate layers of high and low acoustic impedance materials are use, wherein the high acoustic impedance layers are titanium-tungsten alloy layers, preferably deposited by physical vapor deposition, and isotropically patterned with a wet etch. SiO.sub.2 is preferably used for the low acoustic impedance layers, though other low acoustic impedance materials may be used if desired. Electrodes and loads may also be a Titanium-tungsten alloy. Titanium-tungsten alloys in the range of 3 to 15 percent of titanium by weight are preferred.
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