Image sensor chip package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Feb 15, 2007
app pub date -
Jun 7, 2006
filing date -
Aug 12, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A digital camera module includes a barrel (10), a seat (20) and an image sensor chip package (30) in accordance with a preferred embodiment is shown. The image sensor chip package includes a carrier (32), a chip (34), a number of bonding wires (36) and a cover (38). The carrier includes a base (24). The chip is mounted on the base and has an active area. The second conductive means electronically connects the chip and the conductive means. An adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover adheres to the carrier with the adhesive means and defines a sealing space (37) for sealing the active area of the chip therein. The active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.
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