Multilayer coextruded films including frangible intralaminar bonding forces
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United States of America Patent
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Issued Date -
Feb 8, 2007
app pub date -
Aug 5, 2005
filing date -
Aug 5, 2005
priority date (Note) -
Abandoned
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Abstract
Multilayer film structures are disclosed having a first layer of polymer sealant material, a second layer comprising a frangible bond layer, and a third layer comprising an adhesive or polyolefin. The first layer comprises from about 1% to about 10% of the total thickness of the multilayer film structure, has a maximum thickness of about 0.25 mils. and has a thickness uniformity deviation of less than about 20% of the average thickness of the first layer.
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