Low application temperature hot melt adhesive and use thereof in packaging applications

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20070031625A1
SERIAL NO

11197230

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Abstract

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Low application temperature hot melt adhesives are advantageously used to releaseably bond an article, such as a plastic bottle to a base material, such as a cardboard palette.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORP1000 UNIQEMA BOULEVARD NEW CASTLE DE 19720

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gong, Lie-zhong Bridgewater, NJ 15 151
Narthana, Abhi Belle Mead, NJ 3 11

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