Method and apparatus for the application of powder material to substrates
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United States of America Patent
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Issued Date -
Feb 8, 2007
app pub date -
Jun 17, 2004
filing date -
Jun 18, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
There is provided and apparatus and method for electrostatically applying a powder material to substrates. The apparatus includes a plurality of platens, each platen being arranged to hold a plurality of substrates, a conveyor for conveying the platens along a path and an applicator for applying the powder material to the substrates. The method includes the steps of placing the substrates on platens, each platen holding a plurality of substrates, conveying the platens in series along a path and electrostatically applying a powder material to the substrates held on the platens. There is also provided a platen for holding a plurality of substrates to which powder material is to be electrostatically applied, the platen comprising a platen base having a plurality of supports for supporting a plurality of substrates and an electrically conducting platen shield located on the platen base and having a plurality of holes arranged to align with the plurality of supports on the platen base.
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