Package
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United States of America Patent
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N/A
Issued Date -
Feb 1, 2007
app pub date -
Jul 18, 2006
filing date -
Aug 1, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to a package, e.g. a blister package, comprising two spaced apart first and second walls formed and joined to each other to define a cavity between them, said walls having peripheral edges and being sealed together at a peripheral joint essentially along the edges wherein a portion of said peripheral joint comprises at least two conductive surfaces and an electrically weakable adhesive. The invention further relates to an apparatus for supplying electrical power to the package.
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