Method and apparatus for uniformly heating a substrate
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United States of America Patent
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Issued Date -
Jan 25, 2007
app pub date -
Jul 20, 2006
filing date -
Jul 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed in this specification is a method and apparatus for uniformly heating a substrate, comprising the steps of disposing a substrate over heating elements, irradiating the bottom side of the substrate, thus producing a non-uniformly heated substrate. Thereafter the transporter moves the substrate such that the unheated sections are disposed over heating element and heated sections are disposed over the transporter. The substrate is then re-irradiated such that the unheated section becomes uniformly heated. Heat is allowed to radiate from the bottom side to the top side of the substrate, such that the top side achieves a uniform temperature.
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