SMOOTHING PAD FOR BARE SEMICONDUCTOR WAFERS
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Sep 20, 2006
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Jan 12, 2005
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Abstract
One embodiment of the present invention is a smoothing pad for bare semiconductor wafers the smoothing pad for bare semiconductor wafers. The smoothing pad comprises a smoothing body having a closed-cell thermoplastic foam comprising an ethylene vinyl acetate block copolymer comprising a vinyl acetate content ranging from about 1 to about 18 wt %. The smoothing body is substantially free of particles having an average size of greater than about 1 micron. Other aspects of the invention comprise a method of preparing a bare semiconductor wafer and a method of manufacturing a pad for smoothing bare semiconductor wafers.
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