Method for fabricating a light-emitting device

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United States of America Patent

APP PUB NO 20070015300A1
SERIAL NO

11181756

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Abstract

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The present invention discloses a method for fabricating a light-emitting device, wherein a thermosonic bonding process is utilized to join the contacts on a substrate with bond pads on the light-emitting element. Thereby, the deterioration of the substrate can be reduced, and the yield can also be promoted. Further, in the present invention, it is unnecessary to redesign the element specially, and thus, the cost can be lowered.

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Patent Owner(s)

Patent OwnerAddress
TEKCORE CO LTDNO 18 TZU-CHUNG 3RD RD NAN-KUNG INDUSTRIAL ZONE NANTOU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, I-Ling Nantou, TW 21 85
Chyi, Jen-Inn Nantou, TW 62 684
Lee, Chia-Ming Nantou, TW 34 544
Liu, Yu-Chuan Nantou, TW 21 148

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