Method And Apparatus For Emobssing Manufactured Deck Boards
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United States of America Patent
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Issued Date -
Jan 18, 2007
app pub date -
Jul 15, 2005
filing date -
Jul 15, 2005
priority date (Note) -
Abandoned
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Abstract
A method and apparatus are provided for forming embossed simulated boards through a combination of extrusion molding process and separate embossing step. During embossing, the extrudate from the extruder is pressure formed forming a texturized surface on at least one face of the board with the board being captured on all sides of the board during the embossing step. After embossing, the extrudate is cooled to a temperature sufficient to rigidify the thus cooled extrudate. The cooled extrudate may then be cut into the appropriate lengths.
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