Plasma processing apparatus
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United States of America Patent
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N/A
Issued Date -
Jan 18, 2007
app pub date -
Jun 2, 2006
filing date -
Apr 28, 1999
priority date (Note) -
Abandoned
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Abstract
Apparatus for a plasma processing that can minimize losses of power dissipated, allow to shorten processing timescale and improve a yield. There are the insulating and heat insulating means (a plate for insulating and heat-insulating 7C) which is made of the material having low dielectric constant for insulating the high frequency and small thermal conductivity for heat insulating, a placing means (a stage 7A and a cooling plate 7B), for placing an object to be processed, provided with an electrode which is provided in a manner to overlap the insulating and heat insulating means, and to which a high frequency is supplied to generate bias, and a temperature adjusting means (pipings 5A, 5B, a cooling device 5C and a passage 701) which is provided on the placing means and controls temperature of this placing means.
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