Polyamic acid resin composition modified with laminate nanometer silica sheet and polyimide prepared therefrom
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United States of America Patent
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Issued Date -
Jan 11, 2007
app pub date -
Nov 1, 2005
filing date -
Jul 5, 2005
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a polyamic acid resin composition, which is characterized by containing nanolayer silica sheet and/or nanometer silica powder. The present invention also relates to a polyimide film prepared from the composition, the resultant film exhibits improved dimension stability, low water-absorbability, high transparency, and low Coefficient of Thermal Expansion (CTE) value and is suitable used in flexible print wiring board and wiring board for liquid crystal display (LCD).
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