Sputter method or device for the production of natural voltage optimized coatings
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United States of America Patent
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Issued Date -
Oct 20, 2005
app pub date -
Apr 30, 2003
filing date -
May 22, 2002
priority date (Note) -
Abandoned
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Abstract
The invention relates to a method or a device for the production of especially natural voltage optimized coatings, especially low tensile stress coatings, by means of sputter processes, wherein a bipolar voltage shape is produced on the target (cathode). The positive voltage pulse is adjusted on the target in such a way that a bias voltage on the substrate is thus replaced.
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