Apparatus and method for non-contact assessment of a constituent in semiconductor workpieces
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United States of America Patent
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Issued Date -
Jan 11, 2007
app pub date -
Jul 8, 2005
filing date -
Jul 8, 2005
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Abstract
Methods and apparatus for assessing a constituent in a semiconductor workpiece are disclosed herein. Several embodiments of the invention are directed toward non-contact methods and systems for determining a dose and an implant energy of a dopant or other constituent implanted in a semiconductor workpiece. For example, one embodiment of a non-contact method for assessing a constituent in a semiconductor workpiece includes irradiating a portion of the semiconductor workpiece, measuring photoluminescence from the irradiated portion of the semiconductor workpiece, and determining a physical property of a doped structure in the semiconductor workpiece based on the measured photoluminescence.
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