Koji mold-origin phospholipase a2
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United States of America Patent
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Issued Date -
Jan 4, 2007
app pub date -
Mar 2, 2004
filing date -
Mar 4, 2003
priority date (Note) -
Abandoned
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Abstract
It is intended to provide koji mold-origin phospholipase A.sub.2 and a DNA encoding it. Namely, phospholipase A.sub.2 comprising the following protein (a) or (b): (a) a protein having an amino acid sequence represented by SEQ ID NO: 1 or 2; and (b) a protein having an amino acid sequence derived from an amino acid sequence represented by SEQ ID NO: 1 or 2 by a partial modification and serving as phospholipase A.sub.2.
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