$M(c)method for producing inclined flank patterns by photolithography
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United States of America Patent
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Issued Date -
Jan 4, 2007
app pub date -
Aug 5, 2004
filing date -
Aug 7, 2003
priority date (Note) -
Abandoned
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Abstract
The invention concerns a photolithography fabrication method enabling production of patterns in a photosensitive resin layer (601) placed on a substrate (600). The patterns (607) comprise flanks (608) inclined relative to a normal ({right arrow over (n)}) relative to the principal plane of the substrate and which have an angle of inclination (.theta.) far greater to that of the patterns obtained according to the prior art. The invention also concerns a device allowing said method to be executed.
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