Apparatuses and methods for detecting defects in semiconductor workpieces
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United States of America Patent
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Issued Date -
Jan 4, 2007
app pub date -
Jun 26, 2006
filing date -
Jun 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Non-contact methods and apparatuses for detecting defects such as pile-ups in semiconductor wafers are disclosed herein. An embodiment of one such method includes irradiating a portion of a semiconductor workpiece, measuring photoluminescence from the irradiated portion of the semiconductor workpiece, and estimating a density of defects in the irradiated portion of the semiconductor workpiece based on the measured photoluminescence.
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