FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME
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United States of America Patent
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app pub date -
Aug 30, 2006
filing date -
Mar 21, 2002
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Abstract
A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes ('LEDs') and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.
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