Machine vision system and method
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United States of America Patent
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Issued Date -
Dec 28, 2006
app pub date -
Jun 24, 2005
filing date -
Jun 24, 2005
priority date (Note) -
Abandoned
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Abstract
Solder fillets are inspected post-reflow by illuminating firstly from one side only along a dimension through a row of components. Only pixels arising from light received normal to the joints on that side are analysed. There is then illumination from the opposite side and corresponding image analysis normal to the right side fillets only. This avoids noise arising from reflections from a fillet across to the opposite fillet of an adjacent component.
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