Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures
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United States of America Patent
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Jan 7, 2014
Grant Date -
Dec 28, 2006
app pub date -
Jun 21, 2006
filing date -
Jun 22, 2005
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Abstract
A method of forming a thermoelectric device may include forming a first electrically conductive trace, and bonding a thermoelectric element to the first electrically conductive trace. After bonding the thermoelectric element to the first electrically conductive trace, a metal post may be formed on the thermoelectric element so that the thermoelectric element is between the first electrically conductive trace and the metal post. After forming the metal post, the metal post may be bonded to a second electrically conductive trace so that the metal post is between the second electrically conductive trace and the thermoelectric element. Other related methods and structures are also discussed.
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