Polyimide resin and method of preparing the same
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United States of America Patent
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Issued Date -
Dec 21, 2006
app pub date -
May 26, 2006
filing date -
May 30, 2005
priority date (Note) -
Abandoned
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Abstract
The present invention provides a polyimide resin formed by polycondensating a dianhydride monomer including at least a dianhydride monomer represented by formula (I) and a diamine monomer to form a polyamic acid resin, and then cyclodehydrating the polyamic acid. Through using the dianhydride monomer of formula (I) as the polymerizing unit, a biphenyl moiety is introduced into the main chain of polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller thermal expansion coefficient, as well as satisfactory heat resistance and dimensional stability.
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