Polyimide resin and method of preparing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060287468A1
SERIAL NO

11442501

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a polyimide resin formed by polycondensating a dianhydride monomer including at least a dianhydride monomer represented by formula (I) and a diamine monomer to form a polyamic acid resin, and then cyclodehydrating the polyamic acid. Through using the dianhydride monomer of formula (I) as the polymerizing unit, a biphenyl moiety is introduced into the main chain of polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller thermal expansion coefficient, as well as satisfactory heat resistance and dimensional stability.

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Patent Owner(s)

Patent OwnerAddress
CHANG CHUN PLASTICS CO LTD7F NO 301 SONGJIANG RD TAIPEI CITY

International Classification(s)

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  • 2006 Application Filing Year
  • C08G Class
  • 1309 Applications Filed
  • 707 Patents Issued To-Date
  • 54.02 % Issued To-Date

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Kuen-Yuan Hsinchu, TW 53 161
Tu, An-Pang Hsinchu, TW 55 152
Wu, Sheng-Yen Hsinchu, TW 11 56

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  • 2 Citation Count
  • C08G Class
  • 10.11 % this patent is cited more than
  • 19 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges11875218349291276221601 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650700750800

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