Soluble polyimide resin and method of preparing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 21, 2006
app pub date -
May 26, 2006
filing date -
May 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a polyimide resin, which is prepared by epolycondensing a dianhydride monomer including at least a dianhydride represented by formula (I) wherein R is O or O(CH.sub.2).sub.nO, n is an integer of 1 to 2 and a diamine monomer represented by formula (II) H.sub.2N--Ar--NH.sub.2 (II) wherein Ar is defined as in the text then imidizing the resulting polyamic acid resin to form a polyimide resin. Through using the dianhydride represented by formula (I) as the polymerizing unit, a biphenyl moiety and an ester moiety are introduced into the main chain of the polyimide resin, such that the resulting polyimide resin has lower moisture absorption and smaller linear thermal expansion coefficient and therefore have satisfactory heat resistance and dimensional stability, in addition, become more soluble in organic solvents.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully