Substrates and method of manufacturing same

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United States of America Patent

APP PUB NO 20060286301A1
SERIAL NO

10571273

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of preparing substrates, including the steps of depositing metal particulates into a pillar form at a prescribed position of a substrate (1) by the use of a fine inkjet method, and then sintering the resultant to form a metal pillar (2).

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Patent Owner(s)

Patent OwnerAddress
SIJTECHNOLOGY INC5-9-5 TOKODAI TSUKUBA-SHI IBARAKI 3002635 ?3002635

International Classification(s)

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  • 2004 Application Filing Year
  • B05D Class
  • 1428 Applications Filed
  • 464 Patents Issued To-Date
  • 32.50 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20042005200620072008200920102011201220132014201520162017201820190255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hata, Noriaki Ibaraki, JP 8 128
Itoh, Daisuke Ibaraki, JP 49 560
Izumitani, Akihito Ibaraki, JP 4 82
Matsuba, Yosishige Ibaraki, JP 1 26
Murata, Kazuhiro Tsukuba-shi, Ibaraki, JP 56 545
Yokoyama, Hiroshi Ibaraki, JP 168 2188

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Patent Citation Ranking

  • 26 Citation Count
  • B05D Class
  • 83.04 % this patent is cited more than
  • 19 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges35466160593214106431601 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500

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