Electronic devices and a method for encapsulating electronic devices
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United States of America Patent
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app pub date -
Jun 5, 2006
filing date -
Nov 12, 2003
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Abstract
An electronic device can include a substrate, a lid, a getter material adhered to at least a portion of at least one surface of the electronic device, wherein the portion of the surface will be an interior surface of the electronic device, and a sealing material adhered to at least a portion of the substrate and a portion of the lid. The sealing material includes a spacer material. A method for sealing the electronic device includes includes attaching the substrate and the lid in an inert atmosphere under an absolute pressure of less than 760 torr wherein the sealing material contacts both the substrate and the lid, and raising the pressure on the exterior of the device to ambient pressure.
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