Method of diffusion bonding of nickel based superalloy substrates
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United States of America Patent
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Jun 15, 2005
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Jun 15, 2005
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Abstract
A method of transient liquid phase bonding includes the use of an interlayer between the two substrates to be bonded that is alloyed with a melting point reducing element. The interlayer forms a liquid during the bonding process, resulting in superior surface contact between the interlayer and substrates during the bonding process. As the melting point decreaser diffuses out of the interlayer, the interlayer resolidifies, at which point bonding continues under the principles of diffusion bonding.
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