Antistiction MEMS substrate and method of manufacture
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United States of America Patent
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Issued Date -
Dec 14, 2006
app pub date -
Jun 14, 2005
filing date -
Jun 14, 2005
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Abandoned
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Abstract
A composite wafer for fabricating MEMS devices is provided with a plurality of antistiction bumps, buried under a device layer of the composite wafer. The antistiction bumps are prepared lithographically, by patterning an antistiction material prior to the assembly of the composite wafer.
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